Technical Fellow, Advanced Packaging & High Performance Computing
Ottawa, ON, Canada
Full Time
Technical Analysis
Experienced
OUR STORY
TechInsights is the information Platform for the semiconductor industry.
Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, TechInsights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future.
Over 650 companies and 125,000 users access the TechInsights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. TechInsights’ customers include the most successful technology companies who rely on TechInsights’ analysis to make informed business, design, and product decisions faster and with greater confidence. For more information, visit www.techinsights.com.
WHY WORK WITH US
At TechInsights, we decode technology to reveal the innovations shaping our world. As the Technical Fellow, Advanced Packaging & High Performance Computing (HPC), you’ll be a central figure in that mission, a recognized technical authority who bridges semiconductor process, advanced packaging, processor architecture, and system-level performance.
This is a rare opportunity to shape the technical direction of two of TechInsights’ most dynamic product areas: Advanced Packaging and HPC. You will bring deep expertise in packaging and interconnect innovation, from hybrid bonding to co-packaged optics (CPO) and extend that insight up the stack to processors, networking silicon, and full system integration.
Your leadership will help define how TechInsights connects device-level architecture to system-level performance, setting the foundation for next-generation compute analysis across the data center ecosystem.
WHAT YOU’LL DO
Lead with Technical Authority
WORKING ARRANGEMENT
This role is on-site at our Ottawa office.
TechInsights is the information Platform for the semiconductor industry.
Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, TechInsights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future.
Over 650 companies and 125,000 users access the TechInsights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. TechInsights’ customers include the most successful technology companies who rely on TechInsights’ analysis to make informed business, design, and product decisions faster and with greater confidence. For more information, visit www.techinsights.com.
WHY WORK WITH US
- Company-sponsored training and development opportunities
- Comprehensive benefits package (health, dental, vision, wellness, RRSP/401K Matching, annual fitness reimbursement)
- Flexible vacation policy
- Bring your own device program
- Community involvement opportunities through charitable alliances: https://www.techinsights.com/community-involvement
- Wellness resources and support
- Inclusive environment that prioritizes diversity, equity, and accessibility
- High-growth company driven by high performance
- Expected salary range: $175,000 - $195,000 CAD
At TechInsights, we decode technology to reveal the innovations shaping our world. As the Technical Fellow, Advanced Packaging & High Performance Computing (HPC), you’ll be a central figure in that mission, a recognized technical authority who bridges semiconductor process, advanced packaging, processor architecture, and system-level performance.
This is a rare opportunity to shape the technical direction of two of TechInsights’ most dynamic product areas: Advanced Packaging and HPC. You will bring deep expertise in packaging and interconnect innovation, from hybrid bonding to co-packaged optics (CPO) and extend that insight up the stack to processors, networking silicon, and full system integration.
Your leadership will help define how TechInsights connects device-level architecture to system-level performance, setting the foundation for next-generation compute analysis across the data center ecosystem.
WHAT YOU’LL DO
Lead with Technical Authority
- Serve as TechInsights’ subject matter expert across advanced packaging, HPC processors, networking ASICs, memory integration, and data center server architectures.
- Provide authoritative insights on leading-edge and emerging technologies, including:
- 2.5D/3D integration, hybrid bonding, fan-out, glass core substrates, and embedded passives.
- Co-packaged optics, chip-to-chip optical engines, and photonic-electronic IC integration (PIC + EIC).
- Hybrid bonded chiplet stacks, SRAM chiplets, and next-generation thermal and power delivery innovations.
- Shape and maintain TechInsights’ Advanced Packaging and HPC technology roadmaps, aligning analysis coverage with industry trends and customer value.
- Identify and prioritize parts and systems for analysis across processors, accelerators, and networking platforms to capture market-defining innovations.
- Help drive product evolution toward system-level analysis, including server performance testing, interconnect and power delivery characterization, and thermal benchmarking.
- Leverage AI-enabled tools and data workflows to increase the speed, accuracy, and scalability of analysis.
- Create and apply new techniques that connect process flow, packaging design, and system performance metrics.
- Assertively drive content velocity and analytical quality across teams.
- Represent TechInsights worldwide to present at conferences, lead customer technical discussions, and publish thought leadership that positions TechInsights at the forefront of semiconductor intelligence.
- Mentor analysts, shape analytical methods, and foster cross-domain collaboration between packaging, logic, memory, and system analysis teams.
- Travel internationally to meet with hyperscalers, foundries, fabless companies, and system manufacturers.
- A recognized expert in semiconductor packaging, interconnect, or processor design, with 10+ years of relevant industry experience.
- Master’s or PhD in Nanotechnology, Electrical Engineering, Materials Science, Applied Physics, or equivalent field experience.
- Adept at connecting materials, process, and architecture to system-level performance in HPC or networking applications.
- Deeply familiar with one or more of the following domains:
- Advanced packaging and assembly processes (TSVs, interposers, hybrid bonding, fan-out, glass core, embedded passives).
- Processor and chiplet architecture (CPU, GPU, DPU, TPU, FPGA, ASIC).
- Networking and optical interconnect (switch ASICs, SerDes, co-packaged optics, PIC + EIC).
- System-level power, thermal, and performance analysis.
- Demonstrated success applying AI and automation tools to accelerate technical content or workflow efficiency.
- An effective communicator and storyteller comfortable engaging with engineers, executives, and customers alike.
- Motivated by curiosity, collaboration, and a desire to define what comes next in semiconductor analysis.
- Willing to travel globally (up to 25–30%) to build relationships and represent TechInsights at technical and industry events.
WORKING ARRANGEMENT
This role is on-site at our Ottawa office.
Technology knows no bounds, and neither does TechInsights. Bringing together talented humans from different perspectives, backgrounds and abilities is something we take seriously. We’re committed to building an inclusive environment that welcomes you to be your authentic self and allows us to push past the boundaries together.
TechInsights is committed to meeting the needs of people with disabilities. Accommodations are available on request for candidates taking part in all aspects of the selection process.
As part of any recruitment process, TechInsights collects and processes personal data relating to job applicants. We are committed to being transparent about how we collect and use that data and to meeting our data protection obligations. Our Privacy policy can be referenced here: https://www.techinsights.com/privacy-policy
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